To understand the environmental impact of our operations, it is helpful to understand our manufacturing processes. We manufacture memory chips (or die) at our front-end facilities (fabs) in Singapore, Taiwan, Japan and the United States. Using state-of-the-art processes, we add and subtract specialized materials to silicon wafers to create our memory and storage solutions.
Micron’s manufacturing takes place at the nanoscale in a cleanroom environment. Each wafer goes through numerous manufacturing steps, where chemicals and materials are precisely applied to develop the functionality of each chip. Airborne particles, temperature and humidity are tightly controlled to ensure quality as the wafer passes hundreds of times through up to 10 process areas, each with a unique set of tools. From the moment a new wafer enters the fab until all steps are finished, this process can take more than a month. Once complete, a wafer is divided into its constituent die, which are then assembled into numerous customized formats, designed to enable myriad technologies. This back-end operation takes place at our facilities in Singapore, Taiwan, Malaysia and China.